Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot

Product Details
Customization: Available
After-sales Service: Free Lifetime Technical Consulting Services
Warranty: 1 Year
Manufacturer/Factory, Trading Company
Gold Member Since 2023

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

High Repeat Buyers Choice
More than 50% of buyers repeatedly choose the supplier
Self-branded
The supplier has 4 Self-brands, check the Audit Report for more information
Patents Awarded
The supplier had awarded 3 patents, you can check the Audit Report for more information
Production Process Visualization
You can check the supplier's production workflow chart or main facilities in the Audit Report
to see all verified strength labels (18)
  • Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot
  • Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot
  • Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot
  • Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot
  • Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot
  • Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot
Find Similar Products
  • Overview
  • Product Parameters
  • About Us
Overview

Basic Info.

Model NO.
SCA500
Transport Package
FCL
Specification
L8600mm W2860mm H3800mm
Trademark
Skywiretech
Origin
China
HS Code
8486103000
Production Capacity
1000/Year

Product Description

Product Parameters

NO. Item Parameter
1 Processing Capacity
1.1 Ingot length (mm) 500~3000mm
1.2 Ingot diameter (mm) 8-12", max. 350mm (6" requires additional tooling)
1.3 Segment length (mm) 50-700mm(cutting remaining material length 300mm)
1.4 Number of simultaneous cuts at one time 2 cuts
2 Processing Quality
2.1 Processable raw length (mm) 500-3000mm
2.2 Cut-off length deviation (mm) ±0.5mm
2.3 Sample thickness deviation (mm) ±0.2mm
2.4 Thickness difference between the same sample (mm) 8-inch:0.15mm
12-inch:0.25mm
2.5 Surface roughness Within 5um Ra
2.6 Chipping rate (chipping over 1.5mm) Less than 5% (normal chipping rate of head and tail material ≤ 25%)
3 Efficiency and Capacity
3.1 Average cutting speed 10-25mm/min
3.2 Average cutting time 12-inch raw ingot 12-25min (pure cutting time for a single cutter)
4 Consumables Specification
4.1 Wire Tension 0-100N
4.2 Wire Diameter 0.5mm
4.4 Wire Seam Width 0.55mm
4.5 Average Lifetime 8-inch ≥ 180 cuts, 12-inch ≥ 80 cuts
4.6 Wire Length 2960mm
5 Power consumption
5.1 Total power 22.7kw
5.2 Electricity consumption(KW³/H) 13.62
5.3 Power supply 3-phase,5-wire,380V
5.4 Water inlet pressure 0.2-0.4Mpa
5.5 Water consumption(m³/h) 1.2-2.4
5.6 Air inlet pressure(Mpa 0.5-0.7Mpa
5.7 Air consumption(m³/h)  6
5.8 Static load(KN/SQM) 14.3
6 Equipment Specifications
6.1 Equipment size(mm) 8600×2860×3800(mm)
6.2 Body shipping size(L*W*H) 6000×2860×3350(mm)
6.3 Equipment weight (T) 23T

About Us

Tungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal IngotTungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal IngotTungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal IngotTungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal IngotTungsten Wire/Diamond Ring Wirehigh Production Capacity Cutting Machine for Semiconductor Grade Crystal Ingot

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier