Semiconductor Cutting Machine

• After-sales Service: Free Lifetime Technical Consulting Services
• Warranty: 1 Year
• Transport Package: FCL
• Specification: L8600mm W2860mm H3800mm
• Trademark: Skywiretech
• Origin: China
• Model NO.: SCA500
• HS Code: 8486103000
• Production Capacity: 1000/Year

Product Description

Product Parameters

NO.	Item	Parameter
1	Processing Capacity
1.1	Ingot length (mm)	500~3000mm
1.2	Ingot diameter (mm)	8-12", max. 350mm (6" requires additional tooling)
1.3	Segment length (mm)	50-700mm(cutting remaining material length 300mm)
1.4	Number of simultaneous cuts at one time	2 cuts
2	Processing Quality
2.1	Processable raw length (mm)	500-3000mm
2.2	Cut-off length deviation (mm)	±0.5mm
2.3	Sample thickness deviation (mm)	±0.2mm
2.4	Thickness difference between the same sample (mm)	8-inch:0.15mm 12-inch:0.25mm
2.5	Surface roughness	Within 5um Ra
2.6	Chipping rate (chipping over 1.5mm)	Less than 5% (normal chipping rate of head and tail material ≤ 25%)
3	Efficiency and Capacity
3.1	Average cutting speed	10-25mm/min
3.2	Average cutting time	12-inch raw ingot 12-25min (pure cutting time for a single cutter)
4	Consumables Specification
4.1	Wire Tension	0-100N
4.2	Wire Diameter	0.5mm
4.4	Wire Seam Width	0.55mm
4.5	Average Lifetime	8-inch ≥ 180 cuts, 12-inch ≥ 80 cuts
4.6	Wire Length	2960mm
5	Power consumption
5.1	Total power	22.7kw
5.2	Electricity consumption(KW³/H)	13.62
5.3	Power supply	3-phase,5-wire,380V
5.4	Water inlet pressure	0.2-0.4Mpa
5.5	Water consumption(m³/h)	1.2-2.4
5.6	Air inlet pressure(Mpa)	0.5-0.7Mpa
5.7	Air consumption(m³/h)	6
5.8	Static load(KN/SQM)	14.3
6	Equipment Specifications
6.1	Equipment size(mm)	8600×2860×3800(mm)
6.2	Body shipping size(L*W*H)	6000×2860×3350(mm)
6.3	Equipment weight (T)	23T

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